Siemens and TSMC deliver new certifications and design solutions for the foundry’s most advanced process technologies.

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced delivery of a comprehensive design ...

At the 2025 TSMC North America Open Innovation Platform Ecosystem Forum, Siemens Digital Industries Software announced ...

Day by day, technology continues to shrink while the transistor counts on chip increases, leading to greater design complexity. As a result, Metal ECO plays an important role in addressing last-minute ...

Many industry trends are driving chip developers to consider multi-die designs using advanced 2.5D and 3D technologies. Such designs enable incorporating heterogeneous and homogeneous dies in a single ...

In the era of EDA 4.0, artificial intelligence (AI) and machine learning (ML) are transforming what electronic design automation tools are capable of. For many of the challenges of physical IC design, ...

Collaboration with Siemens illustrates TSMC's persistent focus to enable shared customers for the latest and most advanced ...