Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...

SINGAPORE — ST Assembly Test Services Ltd. has expanded its portfolio of solutions for wireless applications with the addition of Land Grid Array (LGA). The LGA is a laminate substrate-based, fine ...

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...