Reliability testing has long served as a method of ensuring that semiconductor devices maintain their desired performance over a given lifetime. As IC manufacturers continue to introduce new and ...

With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as ...

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...

Fairchild fellow Timwah Luk (left) and Jifa Hao, worldwide wafer-level reliability engineer, test ICs well beyond published limits. Photo by Jeff Stevensen. South Portland, ME—Whenyou manufacture more ...

SUSS MicroTec announces the installation of its PM300WLR 300-mm wafer-level reliability (WLR) test system at a leading Japanese manufacturer of semiconductor devices where it will be used to test the ...

Historically, the speed and complexity of electronic circuits required for manufacturing has out-matched the interconnects used to join circuits together. A first approximation of interconnect ...

FREMONT, CA / ACCESSWIRE / December 14, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer ...

STAr Technologies, a leader in parametric and reliability test systems today has launched STAr Pluto series tester to meet test needs for both Package- and Wafer-level reliability test systems. This ...

FREMONT, Calif., Sept. 18, 2023 (GLOBE NEWSWIRE) -- Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer ...

FREMONT, CA / ACCESSWIRE / January 5, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor production test and reliability qualification equipment, today announced it has ...