Abstract: There are several chip-to-substrate interconnection technologies in the packaging tool kit such as mass reflow (MR), thermocompression bonding (TCB) and laser assisted bonding (LAB). MR is a ...

For the healthcare ecosystem to drive research and care, clarity is needed about the opportunities and challenges of ECAs and their value in bringing therapies to patients faster, say COTA Viraj ...

Orange Pi team is gearing up to launch the Orange Pi 6 Plus, a cutting-edge development board featuring an impressive 12-core ARM CPU. This new board is set to capture the attention of both ...