Abstract: Multi-chip power modules with bond-wire contacts at the source area of the die are sensitive to self-excited high-frequency chip-to-chip oscillations (SE-oscillations) between parallelized ...

Abstract: Multi-chip power µModules (micromodule) are widely used in modern electronics systems. Due to high power consumption of µModules, a good packaging design is critical to meet thermal ...

NEW YORK, Jan 13 (Reuters) - The U.S. government said on Monday it would further restrict artificial intelligence chip and technology exports, divvying up the world to keep advanced computing power in ...

An illustration of a magnifying glass. An illustration of a magnifying glass.