Abstract: The most recent cochlear Implants Naida CI Q70 and Q90 from Advanced Bionics have their external devices such as speech processor and head piece (transmitter), Communicate with the reliable ...

Abstract: There are several chip-to-substrate interconnection technologies in the packaging tool kit such as mass reflow (MR), thermocompression bonding (TCB) and laser assisted bonding (LAB). MR is a ...

For the healthcare ecosystem to drive research and care, clarity is needed about the opportunities and challenges of ECAs and their value in bringing therapies to patients faster, say COTA Viraj ...

Aditya Birla Capital shares fall 2.02% on Nifty Midcap 150 Sep 17 2025 02:31 PM Aditya Birla Capital share hits all-time high, rises 1.33% Sep 12 2025 01:48 PM ...