Abstract: The most recent cochlear Implants Naida CI Q70 and Q90 from Advanced Bionics have their external devices such as speech processor and head piece (transmitter), Communicate with the reliable ...

Abstract: There are several chip-to-substrate interconnection technologies in the packaging tool kit such as mass reflow (MR), thermocompression bonding (TCB) and laser assisted bonding (LAB). MR is a ...