Abstract: In recent years, the characteristics required for mounting substrates for AI semiconductor manufacturing, which is developing rapidly, are large area, high rigidity, flatness, low thermal ...

Abstract: This letter presents substrate integrated coaxial line technology (SICL)-based low phase noise (PN) reflection oscillator at 15 GHz. The proposed oscillator circuit is realized using ...

Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential withdrawal amid ...

ThAMeS Multiphase, Department of Chemical Engineering, University College London, Torrington Place, London WC1E 7JE, U.K.