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Abstract: In the semiconductor manufacturing etching process, a considerable amount of good-quality data can be obtained by the measurement process. As the etching process has an impact on subsequent ...

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Abstract: Cu-Cu thermocompression bonding and Cu-Sn-Cu transient-liquid-phase (TLP) bonding are the mainstream metal bonding technologies to electrically connect the vertically stacked chips/wafers in ...

Department of Photonics, Institute of Electro-Optical Engineering, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan International Ph.D.