Abstract: A voltage-divider-based through-silicon-via (TSV) test architecture tests the TSV by using the voltage value differently divided according to TSV defects. This architecture is widely used ...

In modern electronics design, power supply efficiency boasts being one of the most important factors. Whether it be a consumer appliance, an industrial machine, or a renewable energy system – energy ...

School of Textile Materials and Engineering, Wuyi University, Jiangmen 529020, China ...